Lark Project ：https://sisy9sdzrms.feishu.cn/wiki/Wx7Kwdke7iIvx1kS6nccJuWanag

1. Product Name: Water-cooled Workstation

The Water-Cooled Workstation is a desktop-level geek device specifically designed for hardcore mobile game players, completely solving the problems of overheating, frequency reduction, and rapid battery drain during gaming on devices such as mobile phones and iPads.

The product features a stacked structure with a strong E-sports atmosphere: at the top, there is a circulating small water tank with built-in colorful lighting effects and a 3D-printed square air duct, while at the bottom, a 120-specification 12-tube thin cold radiator and a 12V high-efficiency silent fan are integrated, forming a powerful water-cooled heat dissipation base.

The cooling core is located in the dedicated magnetic "cold end": it uses a TEC semiconductor cooling chip stacked with a 40*40 double-sided polished pure copper water-cooled head to achieve efficient and rapid heat transfer and cooling in a single area. In addition, the workstation is equipped with an Arduino nano mini main control brain, which, combined with a DS18B20 water temperature sensor and an NTC thin-film thermistor, can accurately monitor the system temperature in real time and intuitively project various data onto the OLED screen on the front of the host. The entire machine perfectly integrates hardcore temperature control technology, silent experience, and Cyberpunk aesthetics.

Basic Information:

1. Product Name:Water-Cooled Workstation
2. Applicable Devices:Mobile devices with severe heat generation, such as smartphones and iPads
3. Supply Voltage:DC 12V
4. Physical Dimensions:
5. Product Dimensions: 20cm (Length) x 16cm (Width) x 24cm (Height)
6. Dimensions of the cooling base (water cooling radiator): 16 cm (length) x 11.9 cm (width) x 3 cm (thickness).
7. Water Cooling Radiator Weight and Capacity: The empty weight is approximately 206g, and the internal water cooling fluid capacity is approximately 150ml.
8. Cooling end (water block) dimensions: 40mm x 40mm (double-sided polished copper material).
9. Heat Dissipation and Performance Parameters:
10. Water-cooled radiator heat dissipation power: The nominal heat dissipation capacity can reach 365W.
11. Water temperature detection range: -55°C to +125°C (error within ±0.5°C).
12. Cold end detection range: -40°C to +90°C
13. Temperature Resolution: 9~12-bit adjustable high-precision resolution.
14. 
    

序号 物品名称 规格 单价 数量 网址/渠道/供应商 金额

1

For-arduino nano mini超小typec开发板

黑色、328芯片/未焊不送排针、不带数据线

13.90

1

淘宝链接

¥13.90

2

紫铜片

0.1*40mm*40mm（4片）小尺寸

1.50

1

淘宝链接

¥1.50

3

导热双面胶

0.3mm厚：40mm*25米

3.00

1

天猫链接

¥3.00

4

NTC热敏电阻

10K、1%、3950、50MM

0.75

1

淘宝链接

¥0.75

5

制冷片

TEC1-12705 40*40

11.30

1

淘宝链接

¥11.30

6

温度传感器

转接器3P线＋2米防水线

5.50

1

淘宝链接

¥5.50

7

导热硅脂

25克装(银色)

5.10

1

天猫链接

¥5.10

8

水冷液

紫色、无需安装

30.00

1

淘宝链接

¥30.00

9

散热风扇

12厘米（厚度2.5厘米）12V大风

8.80

1

淘宝链接

¥8.80

10

冷排

120 12管薄 螺纹口

28.00

1

淘宝链接

¥28.00

11

宝塔头

外径8MM宝塔

2.30

2

淘宝链接

¥4.60

12

橡胶管

【内径8毫米*外径10毫米】5米长

0.50

1

天猫链接

¥0.50

13

水冷头

40*40mm（两面抛光）

7.50

1

淘宝链接

¥7.50

14

电源适配器

12V8A电源送母线

20.00

1

天猫链接

¥20.00

15

水泵+水箱

c8水泵+方形水箱组合

45.00

1

淘宝链接

¥45.00

16

RGB灯带

5V-WS2812B【白板裸板 5米/盘】、30

12.00

1

淘宝链接

¥12.00

17

OLED屏幕

0.96寸白色OLED模块/4P

10.78

1

淘宝链接

¥10.78

18

PCB板

-

5.00

1

-

¥5.00

总计

¥215.23

5. Instructions for Product Use:

2. 💻 <Product Development Journey>

1. Project Initiation :

Pain Point Discovery: Unbearable "Thermal Throttling" and "Battery Anxiety" I (Li Shen) am a hardcore mobile gamer. During our daily gaming sessions, we have always been troubled by an extremely frustrating problem: As long as the game time is a bit longer, my phone will heat up like a "hand warmer" . Along with the high temperature, not only does the game screen experience severe frame drops and the screen gets forced to dim, but even more critically the phone's battery seems to be drained, with the battery level dropping extremely fast . This terrible situation seriously undermines my gaming immersion, and during crucial team battles, it even causes me to make frequent mistakes.

Reject Mediocrity: Why Don't I Just Buy a Traditional Cooling Device? After encountering this issue, many people asked me, "There are so many phone cooling back clips on the market. Why don't you just buy one?" In fact, I had already studied those traditional cooling devices, but they simply couldn't meet my needs, and there are three reasons for this:

1. The heat dissipation upper limit is too low: Traditional air cooling or small semiconductor back clip have limited heat dissipation area and power, and are simply unable to "suppress the heat" when faced with today's high-quality game blockbusters.
2. The noise is extremely disturbing: Once the air-cooled back clip runs at full load, the fan noise is simply like a helicopter taking off, which greatly affects my voice communication with my teammates and my ability to identify positions by sound in the game .
3. Lack of "geek" soul: As a student who is learning maker knowledge and 3D modeling, I feel that mass-produced products bought in the market lack both personality and coolness. What I want is a truly desktop-level, exclusive E-sports equipment with invincible heat dissipation performance and ultimate quietness.

Spark of Inspiration: Build Your Own Cyberpunk Water Cooling Station Since we can't buy the perfect one, let's build it ourselves! Under the guidance of our teacher, we decided to combine the engineering skills we've learned to build a "high-performance water cooling station" with our own hands.

Solution Discussion

2. Project research and development and testing (Project research and development and testing):

Material Selection —— The "Taobao" Puzzle of Complex Systems

True to our word, after determining the basic water-cooling cycle architecture, we immediately initiated the material procurement process on Taobao. Since the system we are building is a composite system integrating thermodynamic water circulation, the materials involved are very complex, and simply compiling the procurement list took quite a bit of time.

The core large components we need to purchase include: Cold end (40*40 double-sided polished pure copper water block) for attaching to mobile phones, Semiconductor cooling chip (TEC1-12703) as the core cold source, 120-spec 12-tube thin radiator , Silent cooling fan , and Circulating water tank and Rubber tube for connecting the water circuit.

Water-cooled circulation system setup

When all the express parcels were gradually delivered to the studio, looking at the table full of copper plates, cold plates, chips, and pipelines, we all felt a rush of excitement. The materials are all ready, and next, it's time to test our hands-on ability and structural design skills!

Cut rubber tube

We divided the work and cooperated, and according to the pre-drawn whiteboard sketch, we placed the 40*40 purple copper water block, the cooling plate, the 120 thin radiator, the 12V cooling fan, and the small water tank on top one by one. Subsequently, we carefully cut the purple rubber tube and connected the water block, water tank, and radiator in series in sequence, forming a complete closed-loop water circuit.

During the process, we encountered a problem: The tightness of the rubber tube connection was insufficient, and once the water started flowing, water would easily seep and leak out from the joint. After careful investigation, we found that it was because the cable ties (pipe clamps) included in the material kit were too prone to loosening under stress and simply couldn't firmly grip the hose to withstand the internal water pressure generated when the pump was running.

We re-disconnected the water pipes and chose to use cable ties, which are commonly used in the studio, to secure each joint by tightly wrapping the cable tie around it one by one. Moreover, to prevent the pipes from loosening due to pulling during subsequent movement, we also used cable ties to reinforce and bind the spiral cable management tube on the outside of some water pipes, as well as the extended temperature measurement wires.

Power-on test cycle effect

We tested the real cooling power of the core cold source (TEC semiconductor cooling chip) of the test system. Although we couldn't obtain an accurate temperature drop rate curve due to the lack of a thermometer, the power of the cold end was completely visible to the naked eye. For the test, we dropped a few drops of water on the cold surface of the cooling chip, and almost very quickly, a layer of frost appeared on the surface of the originally transparent water droplets.

However, this "hardcore blind test" has also made us aware of a serious problem: if the cooling efficiency is so high and it is directly attached to the phone without control, it will definitely cause a large amount of condensed water to form on the back of the phone, and may even damage the device. Therefore, in the future, we need to consider adding some temperature control devices for real-time temperature collection.

Overcome the "extreme stacking" of cold end temperature measurement

After witnessing the powerful cooling ability of the thermoelectric cooler to turn water into ice, we immediately began to plan a precise temperature control and detection system for the workstation to obtain real-time water temperature and the surface temperature of the water block.

However, when planning the hardware selection and temperature detection for the cold end (the side in contact with the phone), we encountered a significant technical challenge - thickness control of the temperature sensor and protection against condensed water.

First, the cold end must be fully attached to the back of the phone. Any visible bulge will cause poor contact, thereby significantly reducing the cooling effect. To solve this problem, we abandoned the traditional large-sized sensor and finally chose thin-film NTC thermistor .

This is an extremely thin polyimide (PI) film with a thermistor encapsulated inside. Its thickness is usually only about 0.5mm and it can be directly attached to the edge of the cold end of the cooling plate. This is the best choice for measuring surface temperature in extremely confined spaces, perfectly balancing cost and ultra-thin thickness.

Meanwhile, the biggest enemy during the semiconductor refrigeration process is "condensate water". Once the sensor gets damp and short-circuits, the temperature readings on the OLED screen will turn into garbled characters. Additionally, after the NTC film is attached to the cold end of the refrigeration chip, there will still be extremely tiny protrusions on its surface.

So we cut out a piece of high thermal conductivity silicone pad (Thermal Pad, recommended specification: thickness 0.5mm, thermal conductivity 6W/mK) with an area equal to that of the cooling plate and covered it on top.

The silicone pad itself has excellent elasticity, which can not only perfectly absorb and fill the tiny "step difference" (height difference) caused by the NTC film, ensuring 100% internal close contact without loss of cooling efficiency, but also tightly wrap the electronic components, effectively preventing the erosion of condensed water.

Taobao Search for Cold End Module Materials

However, most ordinary thermal conductive silicone pads are slightly sticky, and their original design intention was to be sandwiched between two pieces of metal that do not need to be frequently disassembled (such as chips and heat sinks). If we directly let the silicone pad come into contact with the back of the phone, not only will it cause adhesion and stretching deformation each time it is removed, but the silicone is also extremely prone to dust contamination and will quickly lose its thermal conductivity.

Therefore, we decided to use the ordinary silicone pad merely as the middle "buffer filling layer", and add a non-stick isolation layer with excellent thermal conductivity and an absolutely smooth surface to the outermost layer (the side in direct contact with the phone). We selected a 0.2mmultra-thin purple copper sheet.

The slight stickiness of the silicone pad is just right to firmly hold this metal sheet in place. The smooth metal surface, when in contact with the phone, not only does not adhere but also provides an excellent cool metallic touch. This design not only has almost no loss in heat conduction efficiency but also features a highly industrial and geeky aesthetic. The most advanced phone cooling back clips on the market also adopt a similar smooth metal contact surface solution.

The final formed magnetic cold end structure ("sandwich" stack) After the above repeated deliberation, we finally determined the extremely precise assembly structure of the cold end: The surface of the water block is coated with thermal grease -> covered with a TEC cooling chip -> attached with an NTC thin film resistor -> laid with a slightly sticky thermal silicone pad (to absorb the step difference and prevent water) -> finally covered with a cut smooth copper sheet.

To elevate the user experience to new heights, we have fully embedded this "sandwich" cooling assembly into a custom 3D-printed enclosure and pre-embedded circular magnets at the four corners, designing it entirely in a "magnetic state". Thus, we have not only perfectly resolved the thickness issue in measuring the temperature of the cold end surface but also created an E-sports-grade cooling module that combines high thermal conductivity, zero loss, and supports "instant attachment"!

After the cold end temperature control system was designed, we began to plan the water temperature detection. We used the DS18B20 waterproof temperature sensor, then directly 3D printed a lid at the water tank, inserted the temperature sensor into the water tank through the opening in the lid, and directly obtained the water temperature of the coolant.

PCB Custom Design

After finalizing all the core components, temperature control structure, and physical stacking scheme, looking at the messy and intertwined wires and test adapter boards on the workbench that resembled a spider web, we immediately realized a problem: to transform it from a "laboratory patchwork" into a truly mature and stable desktop-level geek product, we must customize a dedicated PCB (printed circuit board) for it to perfectly integrate the entire complex circuit system.

We opened JLCEDA and began planning this exclusive drawing named "Water Cooling Power Adapter Board".

The power consumption requirements of the entire water-cooled workstation are divided into two parts:

1. High-power "working group" (12V): The cooling fan, semiconductor cooling chip, and circulating water pump, all three are power-hungry components and must be powered by a strong 12V supply.
2. Precise "Brain Power Group" (5V): Arduino nano mini main controller, DS18B20 water temperature sensor, OLED display, and RGB light strip/dot matrix for rendering, all of which require a stable 5V voltage.

We have decided that the entire device will be powered solely by a single 12V power adapter. In the circuit design, we have integrated a mini560 (5V/5A) high-power step-down chip module behind the 12V input terminal. After the 12V current enters the main board, one path is directly delivered to the cooling and heat dissipation modules, while the other path is converted into a stable 5V power supply through the step-down chip to power the main controller, screen, and all sensors.

We connect the DS18B20 temperature measurement module to pin D5 of the main controller, assign RGB lighting to pins D3 and D4, and connect the OLED screen via I2C communication to pins A4/A5.

For the NTC thermistor at the cold end, we have connected a 10K voltage-dividing resistor (R1) in series on the main board, which is connected to the A0 analog pin of the Nano, so that the main controller can accurately calculate the rapid temperature changes on the surface in contact with the phone.

When converting the schematic diagram into a specific PCB layout, we fully considered the convenience of assembly and the safety of high current: as can be seen in the 3D diagram of the PCB, we uniformly adopted green terminal blocks for the input terminal and the 12V output terminals (switches, fans, cooling chips) that need to carry high current, which are not only firm but also highly industrial in appearance. For the 5V sensors and RGB light wires, we used foolproof white anti-drop sockets (such as XH2.54), which greatly reduces the risk of incorrect wiring in the later stage.

We have ingeniously hidden and designed the mini560 voltage step-down module on the back (bottom) of the PCB board, while reserving pin holes for the Nano chip on the front, compressing the area of the entire board to the extreme, just fitting into our 3D-printed base housing. In the trace design of the bottom layer, to handle the instantaneous large current of the cooling chip, we have significantly widened and copper-plated the 12V power supply return path (red and blue trace area) to ensure that the motherboard will never overheat and burn out when the device is operating at full capacity. We have also placed our proud exclusive logo in the upper left corner of the board.

Structural Modeling and Appearance Design

Next, we are going to plan the enclosure part of the entire device for this water cooling system.

To balance heat dissipation performance, hardware installation, and E-sports aesthetics, we have split the overall housing from bottom to top into three core modules: the cold plate base housing, the fan housing, and the water tank housing.

The core of the water cooling system lies in heat dissipation, so during the process of drawing the radiator base and fan base, ensuring the absolute smoothness of the air inlet and outlet is the top priority .

Instead of adopting a rigid fully enclosed design, we specifically modeled an air guiding grid with concentric circles and cross-shaped skeletons for the air intake surface of the fan. On the exhaust side of the radiator, we designed a louvered exhaust port housing with an inclined angle, which not only effectively guides the hot air flow out but also provides good physical protection.

Considering that the previously designed PCB board needs to be connected to various components, we have planned the installation location of the overall circuit on the back of the cold plate base housing. This not only ensures the shortest wiring distance but also allows us to use the physical space of the base to perfectly conceal the complex cables.

To break the dull visual experience of traditional radiators, we have reserved space inside the fan housing and added RGB light strips. When combined with the housing cover we designed with vertically elongated openings, as the machine operates, the internal RGB gradient light will shine through these grid gaps, presenting a highly technological breathing effect.

The water tank is the highest point of the entire water circulation system and also the visual focal point. We added an RGB light panel to the inner bottom of the water tank shell. When the water pump starts, the blue light penetrates the coolant, refracting a sparkling effect, which is really cool.

In terms of the overall product presentation, we did not use a single dull color. Through individual slicing and 3D printing of each module, we deliberately created a multi-color splicing effect of black and gray. Combined with various decorative covers (such as the cold plate seat cover) that we additionally modeled and the exposed screw holes around, the entire water-cooled workstation presents an extremely solid and hardcore "heavy industry aesthetics".

Debugging water-cooled circulation

Program Design and Performance Limit Testing

Faced with complex sensor readings, OLED screen UI drawing, and control of dual-channel WS2812B dynamic light strips, we decided to entrust the writing of the core logic to the AI model Gemini. As it turns out, after just three rapid iterations, the overall effect has fully met our expectations:

1. Version V1: After the code generated by Gemini was burned in for the first time, the screen successfully lit up and a very tech-savvy startup animation "MG COOLING OS BOOTING..." popped up. However, when the water pump was running, we found that the brightness of the RGB light strips inside the fan and water tank was too dim, completely lacking the E-sports vibe. So we forcibly added a patch to the code, pulling the global brightness parameter to the limitFastLED.setBrightness(255), and updated it in the second version.
2. Version V2: After optimizing the brightness, the luminous efficacy reached its maximum, but we soon discovered an embarrassing issue - the display data of "WATER (Water Temperature)" and "TEC PLATE (Cold End Temperature)" on the screen were actually reversed! After investigation, it was found that in the initial prompt given to Gemini, it was not clearly stated that D5 corresponds to DS18B20 and A0 corresponds to NTC, resulting in it writing the logic of the two temperature measurement pins in reverse.
3. Version V3: After redefining the pin definitions and introducing the Steinhart-Hart NTC temperature conversion algorithm to optimize Gemini once again, the third version of the program runs perfectly! With 20ms high-frequency refresh for cool lighting effects and 1000ms low-frequency refresh for UI and temperature control data, the software logic of the entire machine has now been thoroughly implemented.

Real-time water temperature collection

The program is in place, and the temperature control data is clearly visible on the screen. Finally, we can rigorously test the true performance of this water-cooled station. The core cold source we use is TEC1-12705. Before the test, we reviewed its key parameters:

1. Rated Capacity: Powered by 12V, with a maximum operating current of approximately 5A, a maximum cooling capacity Qcmax ≈ 40–45 W, and a maximum temperature difference ΔTmax ≈ 62–67 °C.
2. Reference for theoretical cooling rate: Under good heat dissipation at the hot end, the typical cooling rate is approximately 0.02–0.05 °C/s (1.2–3.0 °C/min). For small-volume, low-heat-capacity loads, the initial cooling rate can reach an extremely fast 0.05–0.08 °C/s (3–5 °C/min).

Measurement 1: Transient Cooling Rate Challenge

We turn on the device, with 12V power fully on, and the huge amount of heat is instantly carried away by the water-cooled radiator and the fan. We stared at the cold end temperature of "TEC PLATE" on the OLED screen. Under the conditions of the cold end being completely unloaded, only the extremely small heat capacity of the cooling chip itself, and excellent water cooling at the hot end, the initial instantaneous cooling rate of TEC1-12705 at 12V will be very fast. Actual measurements show that the temperature of the cold end can drop by 1°C in about 15 seconds (i.e., about 0.1°C/s). This data proves that the stacking solution of "ultra-thin NTC film + thermal conductive silicone pad + ultra-thin copper sheet" we designed has extremely low contact thermal resistance and extremely fierce cold conduction!

Actual Test 2: No-load Extreme Cold Bottoming

The theoretical typical maximum temperature difference ΔTmax of TEC1-12705 is approximately 60~65 ℃. When the ambient temperature is between 25 ℃ and 30 ℃, the theoretical minimum temperature of the cold end can reach an absolute freezing point of -30 ℃ to -40 ℃. Although in practical applications, the lower limit will increase due to contact thermal resistance, current matching, and the heat dissipation limit of the water-cooled radiator (the hot end temperature is generally slightly higher than the ambient temperature). However, in the ideal condition test of "cold end no-load without heat source" we conducted, thanks to the powerful and quiet water-cooled circulation system, the surface temperature of the cold end of this workstation finally broke through zero degrees, plummeted all the way down, and finally stabilized at -8 °C!

Actual Test 3: Full Load High Heat Load Test

Under the standard room temperature environment of 25°C in the classroom, we used a laptop to open the large-scale game CS GO. When the device was running at full load and the back of the computer was hot, we promptly slapped the cold end of the cooling plate onto the back of the computer. The 12V power of the water cooling station was fully activated, and the water cooling circulation at the hot end also maintained the most efficient heat dissipation state.

I stared intently at the temperature fluctuations on the screen. With the strong intervention of cooling, we found that the cold end temperature did not drop below zero all the way like in the second actual measurement, but after a rapid decline, it extremely stably stayed at a number: 5°C .

Combining the conditions of the TEC1-12705 thermoelectric cooler we use, 12V power supply, and good water cooling at the hot end, we have summarized a very practical conclusion:Under this scenario of continuous high-load heat generation, the cold end of the thermoelectric cooler will never reach sub-zero temperatures under no-load conditions, but will stabilize between 0°C and +10°C, and the vast majority of measured cases will fall within the range of 3°C to 7°C.

In - depth analysis: Why is it not below zero under full - load conditions? When reviewing this test, we analyzed the reasons from a thermodynamic perspective:

1. Massive heat source confrontation: When a device (such as a mobile phone) runs a large-scale game at full load, the heat generation power of the entire device is usually between 6W and 10W (even higher for flagship devices with extreme performance). At this time, the cold end no longer cools out of thin air, but must continuously consume the massive heat continuously emitted by the device.
2. Limitations of semiconductor characteristics: Although the TEC1-12705 is powerful, when a large temperature difference is generated between its two ends, its "effective cooling capacity" will drop significantly, and at the same time, the high-load operation of the cooling chip itself will also generate intense heat.
3. Dynamic Thermal Equilibrium: The cold end continuously offsets the heat from the phone, and the system will eventually reach a dynamic tug-of-war equilibrium state, which results in the actual temperature difference between the hot and cold ends being much smaller than that under no-load conditions.

Meanwhile, if the cold end can still forcefully maintain a sub-zero temperature while in contact with a heat-generating device, extremely dangerous condensed water will be produced! Once the temperature drops too low, water vapor in the air will quickly condense or freeze on the back of the phone and even seep onto the motherboard inside the phone. This can easily lead to a short circuit. Therefore, precisely and stably controlling the temperature at 5°C not only allows the phone's processor to fully unleash its performance by completely removing the thermal throttle but also just right avoids the extremely cold trap that causes fatal condensed water.

3. Project Sharing :

To enable more gamers suffering from "thermal throttling" and maker partners interested in hardware DIY to perfectly replicate this "ultra-silent high-performance water-cooled cooling station", we have conducted a thorough review of all the R&D documents of the project and are officially preparing to open source it!

When replicating this machine, the biggest concern is incorrect dimensions or code errors. We have packaged all our efforts into a standard format, and we have open-sourced the entire set of 3D modeling source files (in.SLDPRT format). It includes the "cold plate base", the "fan housing" with an air duct design, the "louvered exhaust hood" with heavy industrial aesthetics, and the most eye-catching "honeycomb water tank housing cover" covered with array holes. After obtaining the files, you can simply throw them into a 3D printer slicer and start printing.

Say goodbye to the troubles of flying wires! We have exported the schematic and PCB prototyping files (Gerber) of the "Water Cooling Power Adapter Board V1.0" drawn in JLCPCB EDA. The board clearly marks the interfaces for 12V input, fan, water pump, cooling chip, as well as the 5V sensor interface.

We also included the complete code iterated by Gemini. The source code not only contains a very smooth U8g2 split-screen UI interface and cool FastLED lighting effect logic, but also comes with our carefully tuned NTC Steinhart-Hart temperature conversion core algorithm, ensuring that every degree of temperature difference is extremely accurate.

At the same time, we have sorted out a BOM purchase list according to the three major modules of the system. Buying according to it will never go wrong. At the end of this document, I wrote a sentence: " Don't complain that the equipment in your hand is not strong enough, because geeks always create absolute freezing points with their own hands! " I hope this open source document can witness the birth of more water-cooled monsters!

Project Sharing Video

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3. ✨ Product Data Open Source / Product Development Journey

Here, a complete guide to the project, design documents, code, and all necessary resources are provided. You can reproduce the project based on these materials, make modifications, or use them as the basis for your own creativity.

We believe that when knowledge and enthusiasm are shared, they generate a tremendous energy that transcends the individual.

Open source means creation, for true creation begins with sharing.